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Title:
SEALING AGENT FOR SEMICONDUCTOR LIGHT-EMITTING DEVICE, SEALING MATERIAL FOR SEMICONDUCTOR LIGHT-EMITTING DEVICE USING THE SAME, AND SEMICONDUCTOR LIGHT-EMITTING DEVICE
Document Type and Number:
Japanese Patent JP2013213182
Kind Code:
A
Abstract:

To provide: a sealing agent for a semiconductor light-emitting device that makes a material abundant and that satisfies in good balance, transparency, heat resistance colorability, thermal shock resistance (crack resistance and peeling resistance), and color fastness (gas barrier properties) that are demanded in semiconductor light-emitting device application; a sealing material for a semiconductor light-emitting device using the same; and a semiconductor light-emitting device.

A sealing agent for a semiconductor light-emitting device includes an isocyanurate compound represented by formula (1), wherein the sealing agent contains more than 70 wt% of the isocyanurate compound based on the total amount of an organic curing component in the sealing agent. In the formula (1), R1, R2, and R3 represent specific substituent groups. At least one among R1, R2, and R3 is an acryloyl group. La represents a C1-4 alkylene group.


Inventors:
MOROOKA NAOYUKI
KOITO NAOKI
TOKUOKA SHINSUKE
IIZUKA YUSUKE
OBAYASHI TATSUHIKO
IKEDA MORIHITO
Application Number:
JP2012221279A
Publication Date:
October 17, 2013
Filing Date:
October 03, 2012
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
C08F20/36; C08G59/20; C08G59/40; C08G77/54; C08L33/14; C08L63/00; C08L83/16; H01L23/29; H01L23/31; H01L33/56; H01L51/50; H05B33/04
Domestic Patent References:
JPS54134795A1979-10-19
JPS6062106A1985-04-10
JPS61209214A1986-09-17
JP2006188559A2006-07-20
JP2006188561A2006-07-20
Attorney, Agent or Firm:
Toshizo Iida
Naosuke Miyamae



 
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