Title:
SEALING APPARATUS AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE
Document Type and Number:
Japanese Patent JP2013126745
Kind Code:
A
Abstract:
To provide a sealing apparatus that can easily fill the sealing material even if a through-hole that easily causes shortage of length of sealing material and a manufacturing method.
The sealing apparatus 100 includes: a body 10 that has a recess 10d, and a communication channel 10e that is opened to the inner surface of the recess 10d; and an elastic plate 20 fixed to the body 10 to cover the recess 10d. A bottom surface 10c of the recess 10d has a first flat part 10c1 and a groove 10c2 (second part) recessed more than a first smooth part 10c1.
Inventors:
MORI MASAHARU
KYO EI
KYO EI
Application Number:
JP2011277249A
Publication Date:
June 27, 2013
Filing Date:
December 19, 2011
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO
International Classes:
B28B11/02
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Takashi Mikami
Yoshinori Shimizu
Takashi Mikami
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