Title:
SEALING APPARATUS FOR SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2003179084
Kind Code:
A
Abstract:
To provide a resin sealing apparatus having low-cost and small-size in which the temperature of a substrate is not remarkably lowered during a period until a preheated substrate is set in a mold or an unevenness does not occur at the temperature of the substrate.
The sealing apparatus for a semiconductor device comprises movable preheaters 31A, 31B having guide rods 32, 32, timing belts 33a, 33b and servo motors 35a, 35b for constituting a special purpose movable preheater drive mechanism so as to reciprocate to the vicinity of the molds 4A, 4B, 4C and 4D.
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Inventors:
OGATA KENJI
Application Number:
JP2002301886A
Publication Date:
June 27, 2003
Filing Date:
July 14, 1999
Export Citation:
Assignee:
DAI ICHI SEIKO CO LTD
International Classes:
B29C45/02; B29C45/72; H01L21/56; (IPC1-7): H01L21/56; B29C45/02; B29C45/72
Attorney, Agent or Firm:
Kaoru Aoyama (4 people outside)