Title:
封止用フィルム接着剤、封止用フィルム積層体及び封止方法
Document Type and Number:
Japanese Patent JP4383768
Kind Code:
B2
Abstract:
A film adhesive for sealing a plurality of chip-type devices on a substrate at one time, including an adhesive layer of an adhesive composition which exhibits a minimum value of a storage modulus of elasticity before curing from 1x10<3 >to 5x10<5 >Pa measured by using a dynamic visco-elasticity measuring apparatus while elevating the temperature from 80° C. to 150° C. at an elevating temperature rate of 2.4° C./min and at a shearing rate of 6.28 rad/sec and a storage modulus of elasticity after curing from 5x10<5 >to 5x10<7 >Pa measured by using a dynamic visco-elasticity measuring apparatus at a sample temperature of 150° C. in a tensile mode at a measuring frequency of 6.28 rad/sec.
Inventors:
Yutaka Hara
Emi Ishii
Emi Ishii
Application Number:
JP2003118862A
Publication Date:
December 16, 2009
Filing Date:
April 23, 2003
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
H01L23/29; C08F210/02; C09J7/22; C09J7/35; C09J123/08; C09J163/00; C09J193/04; C09J201/00; H01L21/56; H01L23/31; H03H9/10; C08L23/08; H03H3/007
Domestic Patent References:
| JP11026656A | ||||
| JP2000017242A | ||||
| JP2001110946A |
Attorney, Agent or Firm:
Takashi Ishida
Jun Tsuruta
Fukumoto product
Masaya Nishiyama
Higuchi Souji
Jun Tsuruta
Fukumoto product
Masaya Nishiyama
Higuchi Souji