To simply seal an electronic device and thereby eliminate a pinhole by forming a heat-curable and/or a photocurable adhesive layer which is composed mainly of an ethylene and vinyl acetate copolymer with a hydrated metal compound added as a flame retardant, on the surface of a light permeable film.
The sealing film for an electronic device has a heat-curing and/or a photocuring curable adhesive layer which is mainly composed of an ethylene and vinyl acetate copolymer, formed on one of the faces of a base material film with light permeability. To cure the adhesive, an organic peroxide or a photosensitizer can be used. However, when the curable adhesive is of a heat-curable type, the organic peroxide is routinely used and when the curable adhesive is of a photocurable type, the photosensitizer is routinely used. The adhesive requires a hydrated metal compound to be added as a flame retardant as an essential procedure. In this case, the hydrated metal compound is, for example, aluminum hydroxide.
SUGIYAMA HIDEO
KOTSUBO HIDESHI
SAKURAI MAKOTO
MATSUSE TAKAHIRO
KITANO TETSUO
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