Title:
封止用フィルム、封止構造体、及び封止構造体の製造方法
Document Type and Number:
Japanese Patent JP7354666
Kind Code:
B2
Abstract:
To provide a sealing film capable of reducing warpage of a sealing structure while realizing thinning of the sealing structure, a sealing structure using the sealing film, and a manufacturing method of the sealing structure.SOLUTION: A sealing film includes: a first layer including a thermosetting resin and an inorganic filler; a second layer including a thermosetting resin and an inorganic filler; and glass cloth. When the second layer is cured, a resultant cured product has a coefficient of thermal expansion that is higher that of a cured product of the first layer.SELECTED DRAWING: None
Inventors:
Yusuke Watase
Yutaka Nomura
Yoshiyuki Tsuchikawa
Hiroyuki Ishige
Masayuki Hama
Atsushi Oizumi
Yutaka Nomura
Yoshiyuki Tsuchikawa
Hiroyuki Ishige
Masayuki Hama
Atsushi Oizumi
Application Number:
JP2019149728A
Publication Date:
October 03, 2023
Filing Date:
August 19, 2019
Export Citation:
Assignee:
Resonac Co., Ltd.
International Classes:
H01L23/29; B32B17/10; C08J5/24; H01L21/56; H01L23/31
Domestic Patent References:
| JP2017204558A | ||||
| JP2016046469A | ||||
| JP2017073432A | ||||
| JP2014116409A |
Attorney, Agent or Firm:
Patent Attorney Corporation Taiyo International Patent Office
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