Title:
SEALING OF IC
Document Type and Number:
Japanese Patent JPS5818931
Kind Code:
A
Abstract:
PURPOSE:To obtain sealing of a thin, small circuit by bonding an IC to a hole perforated through a circuit substrate, loading the hole with a resin pellet and heating the pellet so that it is dissolved. CONSTITUTION:A resin pellet 5 is a tubular tablet of an epoxy resin, etc. A perforation hole 1a of a circuit substrate 1 can be loaded with this tubular tablet without the need for high position accuracy associated with resin dropping, since the tablet diameter is governed by the hole 1a. Also, it is a solid and thus can be treated with ease. A complete sealing of an IC3 can be made by heating the pellet at 150-180 deg.C so that it is dissolved, then it becomes stiff. The weight dispersion between formed resin pellets is far smaller than the vomit volume dispersion of liquid sealing; therefore, the constant amount of resin pellets can be provided for sealing. There is no resin upheaval through the hole 1a towards the reverse side of the substrate 1, and thus the thickness of IC packaging can be reduced to a minimum.
Inventors:
KOMINE ISAO
YOSHIKAWA KENICHI
YOSHIKAWA KENICHI
Application Number:
JP11794981A
Publication Date:
February 03, 1983
Filing Date:
July 28, 1981
Export Citation:
Assignee:
CITIZEN WATCH CO LTD
International Classes:
H01L21/56; H01L21/58; H01L23/28; (IPC1-7): H01L21/56; H01L23/28