Title:
SEALING LIQUID-LIKE EPOXY RESIN COMPOSITION, UNDERFILL MATERIAL, AND SEMICONDUCTOR DEVICE USING THEM
Document Type and Number:
Japanese Patent JP2011084597
Kind Code:
A
Abstract:
To provide a sealing liquid-like epoxy resin composition being excellent in a curing property and storage stability, being excellent in a filling property without generation of a void, maintaining low warpage and being excellent in a heat-impact property, and to provide an underfill material, and a semiconductor device using it.
The sealing epoxy resin composition contains an epoxy resin (A) containing a naphthalene type epoxy resin, an epoxy resin (B) containing a latent curing agent, and a stress relaxing agent (C).
Inventors:
SAITO MITSUKO
TAKADA YOSHIHIKO
KANDA KENTARO
TAKADA YOSHIHIKO
KANDA KENTARO
Application Number:
JP2009236313A
Publication Date:
April 28, 2011
Filing Date:
October 13, 2009
Export Citation:
Assignee:
ASAHI KASEI E MATERIALS CORP
International Classes:
C08G59/20; C08G59/40; C08K3/00; C08L21/00; C08L63/00; C08L83/04; C08L101/00; H01L21/60; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito