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Patent Searching and Data


Title:
SEALING MATERIAL AND CIRCUIT DEVICE
Document Type and Number:
Japanese Patent JPH06220246
Kind Code:
A
Abstract:

PURPOSE: To obtain a circuit device which can be easily processed and has an excellent air tightness.

CONSTITUTION: A glass power for sealing, a polyvinyl butyral resin, dibutyl phthalate, toluene, acetone, and trichloroethylene are mixed and kneaded to give a slurry, which is formed into a sheet. The sheets, 3a and 3b, are used as a sealing material to give a circuit device package.


Inventors:
SUNAHARA KAZUO
NAKAYAMA KATSUHISA
OTA TETSUO
OHASHI TOSHIHIRO
Application Number:
JP3124293A
Publication Date:
August 09, 1994
Filing Date:
January 27, 1993
Export Citation:
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Assignee:
ASAHI GLASS CO LTD
International Classes:
C08K3/40; C08K3/34; C08L101/00; H01L23/10; (IPC1-7): C08K3/40; C08L101/00
Attorney, Agent or Firm:
Kenji Izumina