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Title:
SEALING MEMBER FOR FLOOR FACE CARRYING DEVICE
Document Type and Number:
Japanese Patent JP2001322477
Kind Code:
A
Abstract:

To reinforce the function of preventing wafer from entering from the bottom between a plurality of parallel floor members comprising a floor face of a floor face carrier device.

Sealing members extending in the longitudinal direction of the floor member are arranged between a plurality of parallel floor members 10 and 11 comprising the floor face carrier device. The base part 2 of the sealing member is fitted in a fitting groove 5 formed in one side of one floor member 10. A lip part of the sealing member 1 is constituted of four parts, a first upward lip part 3b, a second upward lip part 3a, a first downward lip part 4b, and a second downward lip part 4a.


Inventors:
OKUDA ZENJIRO
SUZUKI TAKAMI
INOUE KISHO
Application Number:
JP2000138883A
Publication Date:
November 20, 2001
Filing Date:
May 11, 2000
Export Citation:
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Assignee:
MORITA ECONOS LTD
International Classes:
B60P1/36; B65G25/04; F16J15/10; (IPC1-7): B60P1/36; B65G25/04; F16J15/10
Attorney, Agent or Firm:
Shogo Ebara (3 outside)