SEALING METHOD OF ELECTRONIC-COMPONENT HOUSING CONTAINER

Japanese Patent JP3152856

B2

PURPOSE: To obtain a sealing method in which moisture at the inside of an electronic- component housing container is removed and in which an electronic component housed at the inside is operated normally and stanly for a long period by a method wherein a semi- hardened resin adhesive is heated at a temperature at which the adhesive is not softened and melted, moisture on an insulating board and on the surface of a lid body is removed and the semihardened adhesive is heated at a temperature or higher at which the adhesive is hardened completely.
CONSTITUTION: An electronic component 3 is mounted on a mounting part 1a for an insulating board 1, respective electrodes for the electronic component 3 are connected electrically to a metallized wiring layer 5 via bonding wires 6, and a lid body 2 to which a semihardened resin adhesive 7 has been applied is placed on the surface of the insulating board 1. Then, the resin adhesive 7 is heated and dried at a temperature at which the adhesive is not softened and melted, and moisture which has been adsorbed to the surface of the insulating board 1 and to the surface of the lid body 2 is discharged and removed. The resin adhesive 7 is heated at a temperature or higher at which the adhesive is thermally hardened completely, the adhesive is hardened completely, and an electronic-component housing container 4 which is composed of the insulating board 1 and of the lid body 2 is sealed. Thereby, the electrodes for the electronic component 3 and the bonding wires are not corroded, and the electronic component can be operated stably for a long period.

Koichiro Nomoto
Yoji Kobayashi

JP691095A

April 03, 2001

January 20, 1995

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Kyocera Corporation

H01L23/02; H01L23/04; H01L23/10; (IPC1-7): H01L23/02

JP5694649A
JP61232595A

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