Title:
SEALING METHOD OF ORGANIC EL ELEMENT
Document Type and Number:
Japanese Patent JP2007080711
Kind Code:
A
Abstract:
To prevent mixing of air bubble into the adhesion part and prevent deterioration of an organic EL element in the sealing method of the organic EL element.
An EL element 2 is formed on an element substrate 1 (a), a sheet shape adhesive 3 is pasted on the EL element 2 (b), a liquid adhesive 4 is coated on a sealing substrate 5 (c), the element substrate 1 and the sealing substrate 5 are pasted (d), and then the sheet shape adhesive 3 and the liquid adhesive 4 are cured (e).
Inventors:
KUBOTA HIROFUMI
Application Number:
JP2005268054A
Publication Date:
March 29, 2007
Filing Date:
September 15, 2005
Export Citation:
Assignee:
PIONEER ELECTRONIC CORP
International Classes:
H05B33/04; H01L51/50
Attorney, Agent or Firm:
Masayuki Kishida
Hiroji Obana
Mizuno Katsufumi
Hiroshin Takano
Hiroji Obana
Mizuno Katsufumi
Hiroshin Takano