Title:
SEALING METHOD FOR RESIN
Document Type and Number:
Japanese Patent JPS5395579
Kind Code:
A
Abstract:
PURPOSE: To avoid the generation of air bubbles in the resin, by uniforming the injecting speed inthe metal mould independently of the location of the cavity in the mould, through the change of the resin feeding speed from the resin feeder according to the progress of sealing.
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Inventors:
HANYA KIMIHIRO
IWASAKI KATSUKI
IWASAKI KATSUKI
Application Number:
JP1035677A
Publication Date:
August 21, 1978
Filing Date:
February 01, 1977
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K5/00; B29C35/00; B29C45/00; B29C45/14; H01L21/56; H05K5/06; (IPC1-7): B29F1/10; B29G3/00; H01L21/56; H01L23/30; H05K5/06