Title:
SEALING METHOD FOR SEMICONDUCTOR CHIP WITH RESIN AND TRANSFER MOLDING DIE
Document Type and Number:
Japanese Patent JP3246037
Kind Code:
B2
Abstract:
PURPOSE: To change capacity of cavity formed by a die to reduce or remove an unfilled space, a fusion shortage of a void or a weld line, or the like that has so far been apt to cause in a thin package by pressing of the die.
CONSTITUTION: When a semiconductor chip 20 is sealed with sealing resin as a package having a specific thickness, the melted sealing resin is first thickened more than a specific thickness to tentatively seal the semiconductor chip 20. Next, while the sealing resin is not solidified, the sealing resin is compressed to form a package having a specific thickness. A transfer molding die 1 for forming the package comprises upper and lower dies 2, 3, and capacity of package forming cavities 4, 7, 4A, 7A formed by these dies 1 can be changed by movable plates 6, 9. That is, the melted sealing resin is injected up to all the corners of the cavity of the die 1, thereafter the die 1 is pressed to compress the injected sealing resin.
Inventors:
Hideyuki Takahashi
Application Number:
JP4412093A
Publication Date:
January 15, 2002
Filing Date:
March 04, 1993
Export Citation:
Assignee:
ソニー株式会社
International Classes:
B29C45/02; B29C45/14; B29C45/26; B29C45/56; H01L21/56; B29L31/34; (IPC1-7): H01L21/56; B29C45/02; B29C45/26; B29C45/56
Domestic Patent References:
| JP5111931A |
Attorney, Agent or Firm:
Kuninori Funabashi