Title:
SEALING METHOD
Document Type and Number:
Japanese Patent JP2740430
Kind Code:
B2
Abstract:
PURPOSE: To keep air tightness between members securely and to prevent solder material from scattering by pressing a sealing mating face, decreasing the inclination gradually in order to finally make all faces in a parallel state.
CONSTITUTION: When solder 15 is melted, and ends of both joining faces of a ceramic board 1 and a cap 2 touch each other by pressing a board protecting jig 4 with a pressing mechanism 7 upwards, from an inclined state of the joining face of the ceramic board 1 against that of the cap 2 by a specified angle, the melted solder 15 is drawn in a direction of the touching part by the surface tension of the touching part. Accordingly, it becomes possible to obtain a sealing method capable of securely keeping the air tight between members to be joined, and besides capable of securely preventing the scattering of a brazing filler material, namely a joining material.
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Inventors:
Kozo Kanda
Shirai Mitsugu
Shirai Mitsugu
Application Number:
JP28832292A
Publication Date:
April 15, 1998
Filing Date:
October 27, 1992
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H01L23/02; (IPC1-7): H01L23/02
Domestic Patent References:
| JP3173152A | ||||
| JP61276237A | ||||
| JP5320860A |
Attorney, Agent or Firm:
Akita Aki
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