Title:
SEALING PACKAGE FOR SURFACE ACOUSTIC WAVE ELEMENT OR IC
Document Type and Number:
Japanese Patent JP2798375
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a sound sealing package for a surface acoustic wave element or an IC that satisfies a strict air-tight condition as required for the sealing package of a surface acoustic wave element or an IC, and surely protects the element or the IC from oxidation due to oxygen and water content.
SOLUTION: A surface acoustic wave element or an IC 2 is sealed in a package formed by enclosing a cover 4 to a base plate 3, pin terminals being external terminals of the surface acoustic wave element or the IC 2 are implanted through the base plate 3 in this sealing package of the surface acoustic wave element or the IC. The base plate 3 is made of a thermoplastic resin, and the pin terminals 6 are press-fitted to the base plate 3 through thermoplasticity of the thermoplastic resin to form the air-tight support structure at the press-fit boundary.
Inventors:
Suzuki Etsu
Yonezawa Akira
Hidehisa Yamazaki
Kazuhiko Ma
Toshiaki Sato
Yoshiki Tanaka
Yonezawa Akira
Hidehisa Yamazaki
Kazuhiko Ma
Toshiaki Sato
Yoshiki Tanaka
Application Number:
JP14044296A
Publication Date:
September 17, 1998
Filing Date:
June 03, 1996
Export Citation:
Assignee:
Yamaichi Electric Co., Ltd.
KURARAY CO.,LTD.
KURARAY CO.,LTD.
International Classes:
H01L41/09; H01L23/02; H03H9/25; (IPC1-7): H01L23/02; H01L41/09; H03H9/25
Domestic Patent References:
| JP319416A | ||||
| JP3173215A | ||||
| JP4109540U |
Attorney, Agent or Firm:
Takashi Nakahata
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