SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE

Title:

SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE

Document Type and Number:

Japanese Patent JP2021084980

Kind Code:

A

Abstract:

To provide a sealing resin composition that is low in a dielectric loss tangent of a cured product and prevents the occurrence of mold warpage.SOLUTION: A sealing resin composition contains an epoxy resin, a curing agent containing an active ester compound, and at least one particle selected from the group consisting of a polybutadiene particle and a styrene-butadiene copolymer particle.SELECTED DRAWING: None

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WO/1998/029491	POLYMER-ORGANOCLAY-COMPOSITES AND THEIR PREPARATION
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JPH05331296	PRODUCITON OF EPOXY RESIN COMPOSITION FOR CASTING USE

Inventors:

KASUGA KEIICHI
YAMAURA ITARU
IKEDA TOMOHIRO
SAITO TAKAHIRO

Application Number:

JP2019215651A

Publication Date:

June 03, 2021

Filing Date:

November 28, 2019

Export Citation:

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Assignee:

SHOWA DENKO MATERIALS CO LTD

International Classes:

C08G59/42; C08G59/20; C08L9/00; C08L9/06; C08L63/00; H01L23/29; H01L23/31

Attorney, Agent or Firm:

Patent Service Corporation Taiyo International Patent Office

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