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Title:
SEALING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
Japanese Patent JP2022021900
Kind Code:
A
Abstract:
To provide a sealing resin composition that can prevent a support from warping, and an electronic component device produced therewith.SOLUTION: A sealing resin composition contains an epoxy resin and a curing agent and has a stress index of 220 GPa×ppm/°C or lower in a cured state.SELECTED DRAWING: None

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Inventors:
TANAKA MIKA
TAKEUCHI YUMA
SUKEGAWA YUTA
Application Number:
JP2020125773A
Publication Date:
February 03, 2022
Filing Date:
July 22, 2020
Export Citation:
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Assignee:
SHOWA DENKO MATERIALS CO LTD
International Classes:
C08G59/18; C08G59/40; H01L23/29
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office



 
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