Title:
SEALING RESIN COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR DETECTING HOLLOW INORGANIC FILLER
Document Type and Number:
Japanese Patent JP2022117398
Kind Code:
A
Abstract:
To provide a sealing resin composition capable of suppressing deletion/breakage of a hollow inorganic filler.SOLUTION: The sealing resin composition of the present invention contains an epoxy resin (A) and an inorganic filler (B). The inorganic filler (B) contains a hollow inorganic filler (b1). The proportion of a hollow inorganic filler having a diameter of hollow size of 20 μm or more in the hollow inorganic filler (b1) is 5 pieces or less per 1 mg of the sealing resin composition, and the maximum diameter of the hollow size is 45 μm or less.SELECTED DRAWING: None
Inventors:
SATO KAZUNORI
YAMASHITA KOHEI
YAMASHITA KOHEI
Application Number:
JP2021126486A
Publication Date:
August 10, 2022
Filing Date:
August 02, 2021
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L63/00; C08K3/36; C08K7/24; G01N15/02; H01L23/29
Attorney, Agent or Firm:
Shinji Hayami