Title:
封止用樹脂組成物、半導体パッケージ及び半導体パッケージの製造方法
Document Type and Number:
Japanese Patent JP7231833
Kind Code:
B2
Abstract:
This resin composition for sealing comprises an epoxy resin, a curing agent, and a filler, wherein the epoxy resin includes a bisphenol type epoxy resin, and a 1,6-bis (glycidyloxy) naphthalene, and the proportion of the 1,6-bis (glycidyloxy) naphthalene occupied in the whole epoxy resin is 10-30 mass%.
Inventors:
Yuki Hirai
Inoue Hidetoshi
Inoue Hidetoshi
Application Number:
JP2019527079A
Publication Date:
March 02, 2023
Filing Date:
June 29, 2018
Export Citation:
Assignee:
Resonac Co., Ltd.
International Classes:
C08G59/38; C08G59/28; C08G59/50; C08L63/00; H01L21/56; H01L23/29; H01L23/31
Domestic Patent References:
| JP8240809A | ||||
| JP2011225773A | ||||
| JP11029624A | ||||
| JP2013163747A | ||||
| JP2002194053A | ||||
| JP2013028659A | ||||
| JP2011057617A | ||||
| JP2006299247A | ||||
| JP2013082782A |
Foreign References:
| WO2011039879A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Taiyo International Patent Office
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