To provide a semiconductor pressure sensor restricting the generation of leaks subsequent to sealing failures, etc.

A recessed part 25 which becomes wider in the depth is formed at each of both side faces 23a of a recessed groove 23 through which a wiring 21 for taking a fixed electrode 20 outside is provided. A polyimide resin 26 is tightly held in touch with a predetermined position of an inner wall face of the recessed part 25 to closely shut the recessed groove 23 and a pressure chamber 18. specifically, the recessed part 25 comprises a passage 26 opened to the recessed groove 23 and extending in a direction orthogonal to the recessed groove 23, and a seal part 27 continuous with an end of the passage 26 at the deep side. The polyimide resin 26 is constituted of a linear part 29 arranged to traverse the recessed groove 23 and a swelling part 30 formed at each end of the linear part 29. The swelling part 30 is in tight contact with predetermined wall faces 27a, 27b in the seal part 27. Accordingly, even if an alignment shift is generated, the swelling part is kept in tight contact with one of the wall faces, thereby securing hermeticity.