To provide a sealing structure of a light emitting diode chip, and a packaging method of the light emitting diode chip structure in which a matter of a dark zone is solved between the light emitting diode chips, the sealing structure of the light emitting diode chip is simplified, and the manufacturing process can be decreased.
A base unit has a base chassis, and a positive electrode conductive trace and a negative electrode conductive trace formed on the base chassis, respectively. A light-emitting unit has a plurality of light emitting diode chips prepared in the base chassis, and a positive electrode end and a negative electrode end for every light emitting diode chip. The positive electrode end and the negative electrode end of the light emitting diode chip are connected electrically to the positive electrode conductive trace and the negative electrode conductive trace, respectively. A colloid unit covers the base unit and the light-emitting unit. When the light-emitting unit produces a light by applying electricity in the positive electrode conductive trace and the negative electrode conductive trace; the light is guided to the colloid unit, and forms a continuous light-emitting region on the colloid unit.
COPYRIGHT: (C)2008,JPO&INPIT
JUANG FENG-HUEI
WU WEN KUEI
| JP2005322866A | 2005-11-17 | |||
| JP2002353515A | 2002-12-06 | |||
| JP2000261039A | 2000-09-22 | |||
| JP2002358035A | 2002-12-13 | |||
| JP2004179644A | 2004-06-24 |
Masayoshi Yoshida
Hiromitsu Imaeda
Umemura Hiroaki
Shimizu Sakaematsu
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