Title:
SEALING STRUCTURE
Document Type and Number:
Japanese Patent JP2009024838
Kind Code:
A
Abstract:
To provide a sealing structure superior in selability between two members different in a linear expansion coefficient such as quartz and metal used for a manufacturing device of a semiconductor and a liquid crystal, particularly, capable of maintaining high sealability even if a heat cycle is repeated, and having the long service life without cracking a mating member composed of the quartz.
A plate-like fragile member 1 of the quartz is sandwiched and held in an elastic repulsive free state by a metallic main seal 10 and a metallic sub-seal 20.
Inventors:
TODO SATOSHI
KARIYA TAKAHIRO
IKEDA TAKESHI
KARIYA TAKAHIRO
IKEDA TAKESHI
Application Number:
JP2007190969A
Publication Date:
February 05, 2009
Filing Date:
July 23, 2007
Export Citation:
Assignee:
MITSUBISHI CABLE IND LTD
International Classes:
F16J15/08
Domestic Patent References:
JPS6250374A | 1987-03-05 | |||
JP2003194226A | 2003-07-09 | |||
JP2006153062A | 2006-06-15 | |||
JPH05248542A | 1993-09-24 |
Attorney, Agent or Firm:
Takeshi Nakatani