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Patent Searching and Data


Title:
SEALING TREATMENT FOR GOLD PLATED MATERIAL
Document Type and Number:
Japanese Patent JPH03188282
Kind Code:
A
Abstract:

PURPOSE: To sufficiently seal the pinhole part in a goldplated material and to improve corrosion resistance and wear resistance by applying ultrasonic waves to the surface of a gold-plated or gold-alloy-plated material and carrying out sealing treatment.

CONSTITUTION: A material plated with gold or gold alloy is immersed into a treatment solution of an organic amine, etc., by which sealing treatment is applied to the surface of the above material. At this time, the above treatment is carried out by applying ultrasonic waves, by which the reactivity between the sealant and the substrate can be improved, and the pinhole part can sufficiently be sealed. By the above sealing treatment, the gold-plated or gold-alloy- plated material excellent in corrosion resistance and wear resistance can be obtained.


Inventors:
NAKAMURA ISEO
Application Number:
JP32270089A
Publication Date:
August 16, 1991
Filing Date:
December 14, 1989
Export Citation:
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Assignee:
NIPPON MINING CO
International Classes:
C25D3/48; C23C28/02; C23C30/00; C25D5/48; H01R43/16; (IPC1-7): C23C28/02; C23C30/00; C25D3/48; C25D5/48; H01R43/16
Attorney, Agent or Firm:
Hidetake Komatsu (2 outside)