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Title:
SEAMLESS BELT AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2005275335
Kind Code:
A
Abstract:

To provide an excellent intermediate transfer body used for an image forming apparatus and free from image irregularity even in realizing speeding-up by inexpensively molding a seamless belt having a high elastic modulus and being very good in thickness accuracy.

The seamless belt is set so that tensile elastic modulus is ≥1000Mpa and the variation of the thickness of the belt is ≤15μm. A semiconductive belt set so that the common logarithm value of the surface resistivity of the seamless belt is in the range of 7 to 14(logΩ/SQUARE) is constituted so that the surface resistance ratio of both adjacent points obtained in measuring surface resistance at the pitch of 5mm is ≤1.5. In the manufacturing method for the seamless belt, in applying a hollow resin solution extruded from an annular die to the inner surface of a cylindrical metallic mold, gas is injected inside the hollow resin solution so as to expand it. Thus, a solvent is dried after applying the solution to the inner surface of the cylindrical metallic mold.


Inventors:
MATSUSHITA KIICHIRO
KAWAZOE MASAKAZU
KURATA TOMOHIRO
YANO MASAYA
Application Number:
JP2004143707A
Publication Date:
October 06, 2005
Filing Date:
May 13, 2004
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
G03G15/20; B29C41/08; B29D29/00; G03G15/00; G03G15/16; B29L29/00; (IPC1-7): G03G15/00; B29C41/08; B29D29/00; G03G15/16; G03G15/20
Attorney, Agent or Firm:
Takao Suzuki
Koichi Kajisaki
Yuzo Ozaki
Toshihiko Taniguchi