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Title:
SEAMLESS BELT
Document Type and Number:
Japanese Patent JP2006301196
Kind Code:
A
Abstract:

To provide a seamless belt which has superior flexibility and rigidity and high heat conductivity enough to compensate for a thermal deficiency of a belt, excellent slidability for maintaining excellent rotation properties of the belt, and wrinkle preventive effect, and a method for manufacturing the same.

The seamless belt made of polyimide contains a heat-conductive insulating inorganic filler and fluorine resin powder, wherein the heat-conductive insulating inorganic filler of 10 to 40 wt.% is contained in a polyimide-resin-based composition and the fluorine resin powder of 0.1 to 20 wt.% is contained in the polyimide-resin-based composition, the belt external diameter decreases from both the ends to the center part, and an external diameter difference between both the belt ends and the center part is in the rang of 0.03 to 0.5%.


Inventors:
UKAI HIROSHI
Application Number:
JP2005121266A
Publication Date:
November 02, 2006
Filing Date:
April 19, 2005
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
G03G15/00; B29D29/00; B32B27/20; B32B27/30; B32B27/34; C08K3/00; C08L79/08; G03G15/20; C08L27/12
Domestic Patent References:
JPH11156971A1999-06-15
JP2005074940A2005-03-24
JP2004099709A2004-04-02
JP2005017720A2005-01-20
Attorney, Agent or Firm:
Takao Suzuki
Koichi Kajisaki
Yuzo Ozaki
Toshihiko Taniguchi