Title:
SEAMLESS CAPSULE
Document Type and Number:
Japanese Patent JP2018108958
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a relatively large grain diameter seamless capsule.SOLUTION: The diameter of the seamless capsule is set to 5 mm or more, and the ratio T2/T1 of the maximum thickness T2 to the minimum thickness T1 of the film is set to 3.5 or less.SELECTED DRAWING: None
Inventors:
KOYAMA KENICHI
SUZUKI TOMOYA
SUZUKI TOMOYA
Application Number:
JP2016257131A
Publication Date:
July 12, 2018
Filing Date:
December 28, 2016
Export Citation:
Assignee:
SANSHO PHARMA
International Classes:
A61K9/48
Domestic Patent References:
| JP2013071934A | 2013-04-22 | |||
| JP2006512944A | 2006-04-20 |
Foreign References:
| WO2014171433A1 | 2014-10-23 |
Attorney, Agent or Firm:
Ryu Iwatani
Previous Patent: External application constituent
Next Patent: A manufacturing method of halogenation sulfonium salt
Next Patent: A manufacturing method of halogenation sulfonium salt