Title:
SEAMLESS SEMICONDUCTIVE POLYAMIDE-IMIDE BELT AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2003277522
Kind Code:
A
Abstract:
To provide a seamless semiconductive belt which excels in surface smoothness, electrical resistance properties, and mechanical properties, and furthermore heat resistance and chemical resistance, and its manufacturing method.
The seamless semiconductive polyamide-imide belt has a blend of an aromatic polyamide-imide with an aromatic polyimide or a copolymer of an aromatic polyamide-imide with an aromatic polyimide as the major resin component at a constituting ratio of the polyimide-imide to the polyimide in the above blend or copolymer of 1:9 to 9:1, and its manufacturing method is disclosed.
Inventors:
FUJITA TOKIO
Application Number:
JP2002089020A
Publication Date:
October 02, 2003
Filing Date:
March 27, 2002
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
G03G21/00; B29C41/04; C08J5/00; C08K3/04; C08L79/08; G03G15/00; G03G15/16; B29K79/00; B29K105/16; B29L29/00; (IPC1-7): C08J5/00; B29C41/04; C08K3/04; C08L79/08; G03G15/00; G03G15/16; G03G21/00
Attorney, Agent or Firm:
Takao Suzuki (3 others)