Title:
SECONDARY PLATING METHOD OF ROTARY SCREEN OR CYLINDRICAL MESH FOR ROTARY SCREEN
Document Type and Number:
Japanese Patent JPH051399
Kind Code:
A
Abstract:
PURPOSE:To attain a high quality plating on a low strength cylindrical mesh for a rotary screen by plating on the mesh winded and hooked between a horizontal rotary shaft which is a cathode electrode on an upper part of plating bath and a rotary shaft in the plating bath. CONSTITUTION:The cylindrical mesh for the rotary screen is inserted between the horizontal rotary shaft 4 above the Ni plating bath 5 and the weight roll 19 made of a material not to be applied with plating in the plating solution. Electroplating is executed by energizing between the chip housing 12-14 as an anode electrode and the horizontal rotary shaft 4 as a cathode electrode. Since the mesh R is securely winded on the horizontal rotary shaft 4 by gravity of the weight roll 19, the whole surface of the mesh R is uniformly plated with sufficient transmission of plating current by rotation of the horizontal rotary shaft 4.
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Inventors:
TAKAKURA KOICHI
Application Number:
JP18173891A
Publication Date:
January 08, 1993
Filing Date:
June 25, 1991
Export Citation:
Assignee:
THINK LABS KK
International Classes:
C25D5/26; C25D5/12; C25D7/04; (IPC1-7): C25D5/26; C25D7/04
Attorney, Agent or Firm:
Koji Onuma
Next Patent: JPH051400