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Title:
SEGMENT TYPE SUPER ABRASIVE GRINDING WHEEL
Document Type and Number:
Japanese Patent JP2004299019
Kind Code:
A
Abstract:

To provide a segment type abrasive grinding wheel capable of further improving grinding speed.

In the super abrasive grinding wheel, because an adhering interface of a segment chip 34 and a base member 36 is inclined by angle θ with respect to an axis of the base member 36, stress in the direction to peel away acting on the adhering interface based on a centrifugal force caused by the rotation of the grinding wheel 30 and a side pressure acting from the work material in grinding, is reduced at the position of the both ends in the axial direction compared to the case where the adhering interface is provided in parallel to the axis. Since the segment chip 34 is suppressed in peeling away from the base member 36 in the adhering interface even if the grinding wheel peripheral speed is increased, and depth of cuts and feed rate are increased, the grinding wheel peripheral speed can be further increased.


Inventors:
NONOKAWA TAKESHI
Application Number:
JP2003097386A
Publication Date:
October 28, 2004
Filing Date:
March 31, 2003
Export Citation:
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Assignee:
NORITAKE CO LTD
NORITAKE SUPER ABRASIVE KK
International Classes:
B24D5/06; B24D3/00; B24D3/14; (IPC1-7): B24D5/06; B24D3/00; B24D3/14
Domestic Patent References:
JP2000237942A2000-09-05
JP2003062743A2003-03-05
JP2002264018A2002-09-18
JPH10118939A1998-05-12
JP2000079565A2000-03-21
JPH0699357A1994-04-12
JPH06134668A1994-05-17
JP2000210871A2000-08-02
JP2002210663A2002-07-30
JPH0890424A1996-04-09
JPH11188637A1999-07-13
JP2002127020A2002-05-08
JPH0290059U1990-07-17
Attorney, Agent or Firm:
Haruyuki Ikeda