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Title:
選択的レーザ固化装置および方法
Document Type and Number:
Japanese Patent JP6571638
Kind Code:
B2
Abstract:
This disclosure concerns a selective laser solidification apparatus comprising; a powder bed (104, 304) onto which powder layers can be deposited, at least one laser module (1, 2, 3, 4) for generating a plurality of laser beams for solidifying the powder material deposited onto the powder bed (104, 304), a laser scanner (106a, 106b, 106c, 106d, 306a, 306b, 306c, 306d, 306e) for individually steering each laser beam to solidify separate areas in each powder layer (104, 304), and a processing unit (131). A scanning zone (1a, 2a, 3a, 4a, 201a, 201b, 201c, 201d, 301a, 301b, 301c, 301d, 301e) for each laser beam is defined by the locations on the powder bed (104) to which the laser beam can be steered by the laser scanner (106a, 106b, 106c, 106d, 306a, 306b, 306c, 306d, 306e). The laser scanner (106a, 106b, 106c, 106d, 306a, 306b, 306c, 306d, 306e) is arranged at least two of the scanning zones 1a, 2a, 3a, 4a, 201a, 201b, 201c, 201d, 301a, 301b, 301c, 301d, 301e) overlap or are coterminous. The processing unit (131) is arranged for selecting, for at least one of the powder layers, which laser beam to use to scan an area of the powder layer located within a region in which the scanning zones 1a, 2a, 3a, 4a, 201a, 201b, 201c, 201d, 301a, 301b, 301c, 301d, 301e) overlap or are coterminous.

Inventors:
Ben Ian Feller
Seri Brown
Application Number:
JP2016518582A
Publication Date:
September 04, 2019
Filing Date:
June 10, 2014
Export Citation:
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Assignee:
RENISHAW PUBLIC LIMITED COMPANY
International Classes:
B29C64/393; B22F3/105; B22F3/16; B33Y10/00; B33Y30/00; B33Y50/00
Domestic Patent References:
JP2000263650A
JP200589863A
Foreign References:
US20130112672
Attorney, Agent or Firm:
Patent Business Corporation Tani/Abe Patent Office