Title:
SELF-ADHESIVE FILLING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2014234451
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a self-adhesive filling resin composition used together with a semiconductor substrate encapsulant, curable within a brief period at room temperature, yielding a cured product exhibiting, even when left unattended over an extended period at a high temperature, an extremely miniscule degree of yellowish discoloration, and having favorable transparency and adhesiveness.SOLUTION: The provided self-adhesive filling resin composition includes 100 parts.wt. of (A) a diorganopolysiloxane where both molecule chain terminal groups are capped with silanol groups or alkoxy groups, 0.5-25 parts.wt. of (B) an organosilane expressed by the general formula (R)SiXor a partially hydrolyzed condensate thereof, and 0.1-20 parts.wt. of (C) an organosilicon group-containing isocyanuric acid ester having a specified structure.
Inventors:
FUKAZAWA MASAYUKI
KADOMA ATSUHITO
KADOMA ATSUHITO
Application Number:
JP2013116590A
Publication Date:
December 15, 2014
Filing Date:
June 03, 2013
Export Citation:
Assignee:
AICA KOGYO CO LTD
International Classes:
C09J183/04; C08K5/541; C08K5/5455; C08L83/06; C09J183/14; H01L33/56