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Patent Searching and Data


Title:
SELF-CROSSLINKING THERMOSETTING RESIN
Document Type and Number:
Japanese Patent JPH01126313
Kind Code:
A
Abstract:

PURPOSE: To obtain a self-crosslinkable thermosetting resin having a specific structural formula, capable of readily crosslinking and curing without causing volume shrinkage by only heating and providing cured product having excellent weather resistance and corrosion resistance.

CONSTITUTION: A carboxyl group-containing compound expressed by formula I [M is monomer unit derived from a compound having ethylenic unsaturated bond; R is H or methyl; x and y are mol. fraction of each constitutional unit and each represented by the equations 0≤x<90 and 10≤y<100 (mol.%)] is subjected to esterification reaction with a spiroorthoester compound expressed by formula II (X is Cl, Br or I; n is 3, 4 or 5) in the presence of a basic com pound such as 1,5-diazabicyclo[4,3,0]1+-5-ene to provide the self-crosslinking thermosetting resin having a structure expressed by formula III [a, b and c are mol. fraction of each constitutional unit and each represented by the equations 0≤a<90, 5≤b<95, 5≤c<95 (mol.%)] and suitable as a curing mate rial such as molding material or adhesive.


Inventors:
TAGOSHI HIROTAKA
ISOBE NAOKI
NUMAZAWA HIDEKI
ENDO TAKESHI
NISHIKUBO TATATOMI
Application Number:
JP28509987A
Publication Date:
May 18, 1989
Filing Date:
November 11, 1987
Export Citation:
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Assignee:
SHOWA DENKO KK
International Classes:
C08F220/28; C08F8/00; C08F8/14; C08F20/26; C08F220/04; C08F220/06; (IPC1-7): C08F8/14; C08F220/06; C08F220/28
Attorney, Agent or Firm:
Masatake Shiga (2 outside)