Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
自己固定接着アタッチメント
Document Type and Number:
Japanese Patent JP4372006
Kind Code:
B2
Abstract:
A self fixturing adhesive attachment is provided for securely mounting an attachment component such as a threaded stud on the surface of a substrate. The self fixturing attachment includes a base fixture carrying the attachment component and defining a base surface for receiving a selected curable bonding agent thereon. A resilient pressure sensitive adhesive member has a first portion carried by the attachment component at a blind side thereof, a second portion secured to the base fixture, and a third portion extending therebetween. Following pressed mounting of the base fixture with bonding agent thereon onto the substrate, the attachment component is movable to press the first portion of the pressure sensitive adhesive member into adherence with the substrate, resulting in stretched elongation of the third portion thereof to pull the base fixture with a positive force toward the substrate for the duration of the bonding agent cure time.

Inventors:
Footer Charles Jesus The Third
Application Number:
JP2004529259A
Publication Date:
November 25, 2009
Filing Date:
August 05, 2003
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Physical Systems Incorporated
International Classes:
F16B5/00; F16B35/04; C09J5/00; F16B5/02; F16B5/06; F16B5/08; F16B11/00; F16B15/00; F16B37/04
Domestic Patent References:
JP5649410A
JP62122740A
Attorney, Agent or Firm:
Sadao Kumakura
Fumiaki Otsuka
Shishido Kaichi
Village shrine Atsuo
Disciple Maru Ken
Ino Sato



 
Previous Patent: CURRENT CONTROL CIRCUIT

Next Patent: REACTIVE POWER CONTROLLER