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Title:
SEMI-AROMATIC POLYAMIDE COMPOSITION
Document Type and Number:
Japanese Patent JPH09279020
Kind Code:
A
Abstract:

To provide a semi-aromatic polyamide composition from which a highly accurate and heat resistant molding can be produced with little stain on a mold and little clogging in mold vent.

This semi-aromatic polyamide composition comprises [I] a semi-aromatic polyamide having 40-90mol% repeated unit comprising terephthalic acid and a 4-12C aliphatic diamine (A), 0-50mol% repeated unit comprising isophthalic acid and a 4-12 C aliphatic diamine (B), 0-60mol% repeated unit comprising a 4-12C aliphatic dicarboxylic acid and a 4-12C aliphatic diamine (C), and 0-50mol% repeated unit comprising a 6-12C lactam or aminocarboxylic acid (D) and contg. not more than 0.25wt.% low mol.wt. boiling water soluble component(MO component), and [II] a fire retardant.


Inventors:
SUDO MASARU
OUCHI KUNIHIRO
MURAKAMI HIDETATSU
Application Number:
JP9104896A
Publication Date:
October 28, 1997
Filing Date:
April 12, 1996
Export Citation:
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Assignee:
MITSUI PETROCHEMICAL IND
International Classes:
C08K5/098; C08K7/02; C08L25/18; C08L71/00; C08L71/12; C08L73/00; C08L77/00; C08L77/06; (IPC1-7): C08L77/06; C08K5/098; C08K7/02; C08L25/18; C08L71/12
Attorney, Agent or Firm:
鈴木 俊一郎