To provide a semi-aromatic polyamide composition from which a highly accurate and heat resistant molding can be produced with little stain on a mold and little clogging in mold vent.
This semi-aromatic polyamide composition comprises [I] a semi-aromatic polyamide having 40-90mol% repeated unit comprising terephthalic acid and a 4-12C aliphatic diamine (A), 0-50mol% repeated unit comprising isophthalic acid and a 4-12 C aliphatic diamine (B), 0-60mol% repeated unit comprising a 4-12C aliphatic dicarboxylic acid and a 4-12C aliphatic diamine (C), and 0-50mol% repeated unit comprising a 6-12C lactam or aminocarboxylic acid (D) and contg. not more than 0.25wt.% low mol.wt. boiling water soluble component(MO component), and [II] a fire retardant.
JP6861188 | Thermoplastic resin composition and its molded article |
JP2002363358 | THERMOFORMED CONTAINER |
WO/2023/075115 | POLYETHYLENE RESIN COMPOSITION AND FILM COMPRISING SAME |
OUCHI KUNIHIRO
MURAKAMI HIDETATSU
Next Patent: SEMI-AROMATIC POLYAMIDE COMPOSITION