Title:
SEMI-AROMATIC POLYAMIDE RESIN COMPOSITION AND MOLDING INCLUDING THE SAME
Document Type and Number:
Japanese Patent JP2023103598
Kind Code:
A
Abstract:
To provide a semi-aromatic polyamide resin composition that excels in low wear resistance and extrusion processability, and a molding including the same.SOLUTION: The present invention provides a semi-aromatic polyamide resin composition. Relative to 100 pts.wt. of (A) a semi-aromatic polyamide (A component) comprising a dicarboxylic acid component primarily composed of terephthalic acid and an aliphatic diamine component primarily composed of 1,10-decane diamine, (B) an aliphatic polyamide (B component) is 0.1 pt.wt. or more and less than 3 pts.wt., (C) a fibrous inorganic filler (C component) is 5-100 pts.wt. and (D) a slidability imparting agent (D component) is 1-20 pts.wt.SELECTED DRAWING: None
Inventors:
MORI YUKI
Application Number:
JP2022004211A
Publication Date:
July 27, 2023
Filing Date:
January 14, 2022
Export Citation:
Assignee:
TEIJIN LTD
International Classes:
C08L77/06; C08K7/04; C08K7/06; C08L27/12; C08L77/02
Attorney, Agent or Firm:
Taro Tameyama