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Title:
SEMI-CONDUCTIVE RESIN COMPOSITION AND MOLDING
Document Type and Number:
Japanese Patent JP3859966
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a semi-conductive liquid crystalline polymer composition suitable for electronic parts endowed with stable antistatic property without largely deteriorating mechanical property.
SOLUTION: This semi-conductive resin composition is prepared by compounding 1-50 pts.wt. graphite (B) with a fixed carbon content of not less than 95 wt.%, 1-50 pts.wt. fibrous conductive filler (C), and 1-50 pts.wt. fibrous nonconductive filler (D) to 100 pts.wt. liquid crystalline polymer (A), wherein total compounded quantity of components (B), (C), and (D) is 25-100 pts.wt. to 100 pts.wt. of (A), and (B):(C)=1:3-4:1, and [(B)+(C)]:(D)=1:2-2:1 are satisfied, and it has a volume resistivity of 1×104-1×1011 Ω.cm.


Inventors:
Takayuki Miyashita
Otake Mineo
Application Number:
JP2000392903A
Publication Date:
December 20, 2006
Filing Date:
December 25, 2000
Export Citation:
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Assignee:
Polyplastics Co., Ltd.
International Classes:
C08J5/00; C08L101/12; C08K3/04; C08K7/02; C08K7/04; C08L101/00; H01B1/00; H01B1/24; H05F1/00; (IPC1-7): C08L101/00; C08J5/00; C08K3/04; C08K7/04; H01B1/00; H01B1/24; H05F1/00
Domestic Patent References:
JP10036679A
JP11116818A
JP2002194194A
JP2000017179A
Foreign References:
WO2000034369A1
Attorney, Agent or Firm:
Satoshi Furuya
Kaoru Furuya
Takahiko Mizobe
Shinji Mochida
Yoshitsune Kazumasa



 
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