To increase the grinding speed of a circumferential surface of a semi- conductor wafer, the efficiency in grinding many semi-conductor wafers, and grind the semi-conductor wafer without leaving a holding trace by a wafer holding member on a surface of the semi-conductor wafer.

A semi-conductor wafer grinding equipment is provided with a wafer support mechanism to locate a plurality of semi-conductor wafers (w) on the first axis of rotation parallel to each other with intervals, and rotatably support each semi-conductor wafer, a drive roller 31 which is rotated around the second axis of rotation parallel to the first axis of rotation and drives each semi-conductor wafer in an abutted manner on the circumferential surface of each semi-conductor wafer, and a grinding drum 8 which is rotated around the third axis of rotation parallel to the first axis of rotation and drives the circumferential surface of each semi-conductor wafer (w) in an abutted manner on the circumferential surface.