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Patent Searching and Data


Title:
SEMI-CURED SHEET MOLDING COMPOUND
Document Type and Number:
Japanese Patent JPS557839
Kind Code:
A
Abstract:

PURPOSE: To provide a sheet molding compound, non-sticking at room temperature, having excellent storage stability, and giving a laminate having high dimensional stability, weatherability, resistance to water, resistance to solvents, and inter-laminar adhesive strength, and composed of a core layer and a pair of reinforcing layers laminated to both surfaces of the core layer.

CONSTITUTION: A laminated sheet composed of a core layer and two surface- reinforcing layers laminated to both surfaces of the core layer, wherein the core layer is composed of a resin composition composed mainly of a normally solid unsaturated epoxy compound having an equivalent ratio of ethylenic unsatrated group/ epoxy group of 1/5 W 5/1, and the surface-reinforcing layers are made of a reinforced unsaturated epoxy compound, unsaturated polyester resin and/or epoxy resin, having a non-restricted equivalent ratio of ethylenic unsaturated group/epoxy group. The laminate is semi-cured by UV irradiation, etc. to afford a sheet which is not sticky at room temperature.


Inventors:
IBATA JIYOUJI
KATOU MICHIO
YUASA TAKEO
FUKUI HISAAKI
Application Number:
JP8007578A
Publication Date:
January 21, 1980
Filing Date:
July 01, 1978
Export Citation:
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Assignee:
ASAHI CHEMICAL IND
International Classes:
B32B27/38; C08J5/24; (IPC1-7): B32B27/38; C08J5/24