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Title:
SEMI-TRANSPARENT RESIN COMPOSITION FOR LASER BEAM MACHINING AND ARTICLE PREPARED BY LASER BEAM MACHINING
Document Type and Number:
Japanese Patent JP3590111
Kind Code:
B2
Abstract:

PURPOSE: To provide a semi-transparent resin compsn. having excellent balance between laser marking machinability, mechanical properties and heat resistance by comprising predetermined amts. of a particular copolymer and a particular rubber-reinforced styrene resin.
CONSTITUTION: This semi-transparent resin compsn. for laser beam machining, comprises 10 to 80wt.% (hereinafter referred to as '%') copolymer of 90 to 10% maleimide (or a derivative thereof) (e.g. an N-phenylmaleimide) with 10 to 90% at least one compd. (e.g. methyl methacrylate) selected from an arom. vinyl compd. (A), an unsatd. nitrile compd. (B), and an unsatd. carboxylic acid alkyl ester compd. (C); and 90 to 20% rubber-reinforced styrene resin comprising 5 to 100% graft polymer, prepd. by polymerizing a rubber-like polymer having a gel content of 20 to 95% (e.g. polybutadiene) with at least two compds. selected form the compds. (A), (B), and (C) (e.g. styrene and acrylonitrile), the graft polymer having a graft ratio of 20 to 130% and a wt. average particle diameter of 0.05 to 3μm, and 95 to 0% copolymer, of at least two compds. selected from the compds. (A), (B), and (C), having an intrinsic viscosity of 0.4 to 1.5.


Inventors:
Hiromitsu Aoki
Hideki Yamaguchi
Koichi Saka
Moto Sakano
Application Number:
JP29384794A
Publication Date:
November 17, 2004
Filing Date:
November 02, 1994
Export Citation:
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Assignee:
Nippon A & L Inc.
International Classes:
C08J7/00; C08L25/00; C08L33/00; C08L33/04; C08L33/18; C08L33/24; C08L35/00; C08L51/00; C08L51/04; (IPC1-7): C08L25/00; C08J7/00; C08L33/04; C08L33/18; C08L35/00; C08L51/04
Domestic Patent References:
JP61016955A
JP5230306A
JP6263942A
JP8048840A
JP3066739A
JP6060761A