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Title:
SEMICONDUCTING POLYIMIDE BELT
Document Type and Number:
Japanese Patent JP2008225181
Kind Code:
A
Abstract:

To provide a semiconducting polyimide belt with which a configurational deterioration phenomenon of the belt surface scarcely occurs even when continuously used, which is excellent in durability, and with which degradation of an image scarcely occurs by setting a molar ratio of a diamine component to be within a predetermined range in the presence of a catalyst and in the absence of a dehydrating agent so as to improve a balance between its flexibility and rigidity.

The semiconducting polyimide belt includes a conductive filler. The belt includes a copolymer which is obtained by polymerizing 3,3',4,4'-biphenyl tetracarboxylic acid dianhydride, p-phenylenediamine ( component A), and 4,4'-diaminodiphenyl ether (component B) in the presence of the catalyst and in the absence of the dehydrating agent, wherein the molar ratio of the component A and the component B is represented by A/B=7/3 to 3/7.


Inventors:
IWAMOTO TOSHIAKI
Application Number:
JP2007064978A
Publication Date:
September 25, 2008
Filing Date:
March 14, 2007
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
G03G15/00; C08G73/10; G03G15/16
Domestic Patent References:
JP2006301255A2006-11-02
JP2006267572A2006-10-05
JP2006259248A2006-09-28
JP2004341281A2004-12-02
JP2004287012A2004-10-14
Attorney, Agent or Firm:
Yuzo Ozaki
Koichi Kajisaki
Toshihiko Taniguchi