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Patent Searching and Data


Title:
SEMICONDUCTING THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH11181270
Kind Code:
A
Abstract:

To obtain the subject composition having volume resistivity of semiconducting region in which the change due to moisture is small, scarcely exhibiting corrosive property to metal and useful as a static charge member, etc., for electrophotographic type image forming apparatus by including a polyalkylene oxide and a specific alkali metal salt, etc., at a specific ratio.

This thermoplastic resin composition normally comprises (A) 2-99.9 wt.% polyalkylene oxide (e.g. polyethylene oxide) having 1,000-10,000,000 weight-average molecular weight, (B) 0-97.9 wt.% other thermoplastic resin, preferably vinylidene fluoride-based resin (e.g. polyvinylidene fluoride) and (C) 0.1-5 wt.% alkali metal salt having ≤1 g/L solubility to water at 23°C, preferably cesium perfluoroalkylsulfonate (e.g. cesium perfluorooctanesulfonate). The composition is useful for antistatic films for packaging electronic parts and dust absorption preventing members for various OA equipment, etc.


Inventors:
KITAMURA HIDEKI
MATSUNAGA SATORU
TERAMOTO KAKICHI
AKATSU MASAMI
TERAJIMA HISAAKI
Application Number:
JP36601697A
Publication Date:
July 06, 1999
Filing Date:
December 24, 1997
Export Citation:
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Assignee:
KUREHA CHEMICAL IND CO LTD
International Classes:
G03G15/02; C08K5/42; C08L27/16; C08L71/02; C08L101/00; (IPC1-7): C08L71/02; C08K5/42; C08L27/16; C08L101/00; G03G15/02
Attorney, Agent or Firm:
Nishikawa Shigeaki