PURPOSE: To keep the supporting position of an acceleration sensor constant and to improve the accuracy of the output characteristics by die bonding the sensor chip with good positional accuracy by a chip supporting lead and by supporting the end with mould resin.

CONSTITUTION: An acceleration sensor chip 1 is die bonded with a sunk die pad 12, a chip 1 is located by a chip supporting lead 13 arranged in the end of a lead frame 11, and an acceleration sensor chip supporting part 15 formed of mould resin supports the end. While the chip l is placed on the pad 12 provided to the frame 11, the chip 1 is accurately located by the lead 13. The end of the chip 1 is supported by the supporting part 15. By this, the chip 1 can be supported at the constant position after mould forming, the output characteristics becomes constant, and the accuracy is improved.