Title:
半導体加速度センサ装置及びその製造方法
Document Type and Number:
Japanese Patent JP4277079
Kind Code:
B2
Abstract:
Although a weight part of an acceleration sensor chip fixed on a die pad is coated with a gelatinous resin part of low elasticity, the weight part is easily displaced by an external acceleration. Thus, an acceleration can be detected with accuracy. Furthermore, long-term reliability equal to those of regular resin packages is ensured because those portions of an acceleration sensor device which are not used for acceleration sensing are sealed with a resin part.
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Inventors:
Yoshinori Kashino
Application Number:
JP2004181596A
Publication Date:
June 10, 2009
Filing Date:
June 18, 2004
Export Citation:
Assignee:
oki Semiconductor Co., Ltd.
International Classes:
G01P15/08; B81B7/02; G01P1/02; G01P15/12; H01L21/56; H01L23/28
Domestic Patent References:
| JP10197374A | ||||
| JP1143963A | ||||
| JP2003254988A | ||||
| JP2001227902A | ||||
| JP2004170390A | ||||
| JP2000214177A |
Foreign References:
| US6323529 | ||||
| US6435028 |