To provide semiconductor adhesive films good in workability and yield due to the good adhesiveness to a polyimide film of a substrate film, and lead frames, and also provide semiconductor devices using the same.

This semiconductor adhesive film uses a polyimide film having a strongest absorption at not lower than 553 cm-1 between 550 and 560 cm-1 in the IR spectrum as the substrate film and a heat-resistant thermoplastic resin as the adhesive layer at one side or both sides of the substrate film. It is preferred that the heat-resistant thermoplastic resin contains at least one of aromatic polyamide, aromatic polyimide, aromatic polyamideimide, aromatic polyetheramide, aromatic polyetherimide and aromatic polyetheramideimide.