Title:
SEMICONDUCTOR ADHESIVE RESIN COMPOSITION, SEMICONDUCTOR ADHESIVE SHEET AND SEMICONDUCTOR DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2017002181
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor adhesive resin composition that has excellent thermal conductive property and electric conductive property, and that is optimum for bonding between a power semiconductor element and an element supporting member.SOLUTION: Provided are: a semiconductor adhesive resin composition comprising (A) a bismaleimide resin having an aliphatic hydrocarbon group in the main chain, (B) a curing agent, (C) a filler containing conductive particles having a specific gravity of 1.1 to 5.0, and (D) silver fine particles having an average particle diameter of 10 to 300 nm; a semiconductor adhesive sheet obtained by using the semiconductor adhesive resin composition; and a semiconductor device in which a semiconductor is bonded by the semiconductor adhesive sheet.SELECTED DRAWING: None
Inventors:
FUJIWARA MASAKAZU
FUKUKAWA HIROSHI
FUKUKAWA HIROSHI
Application Number:
JP2015117444A
Publication Date:
January 05, 2017
Filing Date:
June 10, 2015
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
C09J133/24; C09J7/00; C09J11/02; H01B1/00; H01B1/22; H01L21/52
Domestic Patent References:
| JP2014194013A | 2014-10-09 | |||
| JPH0953001A | 1997-02-25 | |||
| JP2005044524A | 2005-02-17 |
Foreign References:
| US20130306916A1 | 2013-11-21 | |||
| US20040225059A1 | 2004-11-11 | |||
| WO2010019832A2 | 2010-02-18 |
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office