To provide a semiconductor apparatus, an identification device of semiconductor apparatus and a manufacturing device of semiconductor apparatus which enable an identification pattern hidden between two semiconductor devices to be imaged so that identification information can be read even when the semiconductor apparatus is of chip stack type wherein a plurality of semiconductor devices are laminated.

The semiconductor apparatus 10 includes: a first semiconductor device 11 having an identification pattern 19, showing the identification information, on a surface 11a; a second semiconductor device 12 laminated over the surface 11a of the first semiconductor device 11 interposing a bonding layer 15; and an opening portion 15a penetrating the bonding layer 15 in its thickness direction H. The identification pattern 19 is made of a material which has a low transmission factor for infrared rays on the inner side of the opening portion 15a of the bonding layer 15.