SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME

Title:

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME

Document Type and Number:

Japanese Patent JP2005228298

Kind Code:

A

Abstract:

To provide a chip having a memory and the like and having a thin-film integrated circuit thin like paper mounted; to provide an extremely thin integrated circuit that uses the chip, has a label attached thereto, and can be mass-produced at a low cost; and to provide a formation method thereof.

This thin-film integrated circuit is formed by a method that can form a pattern selectively, on a glass substrate, a quartz substrate, a stainless substrate, a substrate made of a synthetic resin having flexibility, such as acrylic, or the like except for a bulk substrate. Further, a semiconductor apparatus with the thin-film integrated circuit and an antenna mounted is formed. Thereby, problems wherein an IC card is more expensive than a magnetic card, and an electronic tag is also more expensive as a substitute for bar codes can be solved.

Inventors:

MAEKAWA SHINJI
FUJII ITSUKI
MARUYAMA JUNYA
TAKAYAMA TORU
ONO YUMIKO
ARAI YASUYUKI

Application Number:

JP2004365771A

Publication Date:

August 25, 2005

Filing Date:

December 17, 2004

Export Citation:

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Assignee:

SEMICONDUCTOR ENERGY LAB

International Classes:

B42D15/10; G06K19/07; G06K19/077; H01L21/336; H01L21/822; H01L27/04; H01L29/786; (IPC1-7): G06K19/077; G06K19/07; H01L21/336; H01L21/822; H01L27/04; H01L29/786

Domestic Patent References:

JP2003123047A

2003-04-25

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