Title:
SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2009099697
Kind Code:
A
Abstract:
To provide a semiconductor apparatus and method of manufacturing the same which can finely mount and wire-bond a thin semiconductor chip laminated in a plurality of stages without causing a chip crack.
The semiconductor apparatus 1 has: a first semiconductor chip 6 laminated on a wiring substrate 2 and arranged with a first electrode pad 7 at a predetermined position of an upper face; a second semiconductor chip 10 which is shifted so as to expose the first electrode pad 7 through an insulating means (bonding member 12) and is laminated on the first semiconductor chip 6; and a support member 15 for supporting the rear of a protruding part of the second semiconductor chip 10 through the insulating means (bonding member 12).
Inventors:
FUJIWARA REIKO
HATAZAWA AKIHIKO
WATANABE FUMITOMO
HATAZAWA AKIHIKO
WATANABE FUMITOMO
Application Number:
JP2007268504A
Publication Date:
May 07, 2009
Filing Date:
October 16, 2007
Export Citation:
Assignee:
ELPIDA MEMORY INC
International Classes:
H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2002373968A | 2002-12-26 | |||
| JP2006013268A | 2006-01-12 | |||
| JP2001217383A | 2001-08-10 | |||
| JP2009054747A | 2009-03-12 | |||
| JP2004253693A | 2004-09-09 | |||
| JP2006005333A | 2006-01-05 | |||
| JP2004071947A | 2004-03-04 |
Attorney, Agent or Firm:
Kenho Ikeda
Shuichi Fukuda
Takashi Sasaki
Shuichi Fukuda
Takashi Sasaki