Title:
SEMICONDUCTOR BAR ALIGNING DEVICE
Document Type and Number:
Japanese Patent JP3791756
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor bar aligning device which can insert a semiconductor bar stably in a holder for film formation.
SOLUTION: This semiconductor bar aligning device comprises a bar positioning part 1 for positioning the semiconductor bar 10 formed by cutting a semiconductor wafer, a holder 2 for film formation which holds the semiconductor bars stacked in such a state that cut surfaces are exposed, a bar carrying mechanism 3 for carrying the semiconductor bar 10 from the bar positioning part 1 to the holder 2, and a control operation processing part for controlling the respective parts. A first CCD camera 5 photographing the holder 2 is installed above the holder 2. The control operation processing part performs position adjustment of the holder 2 on the basis of the image photographed by the CCD camera 5.
Inventors:
Ueda, Sadaaki
Application Number:
JP2000000271803
Publication Date:
April 14, 2006
Filing Date:
September 07, 2000
Export Citation:
Assignee:
SHARP CORP
International Classes:
B65D85/86; H01L21/68; B65G57/04; H01L21/683; H01S5/028; B65D85/86; H01L21/67; B65G57/02; H01S5/00; (IPC1-7): H01L21/68; B65D85/86; B65G57/04; H01S5/028
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